Press Releases from ULVAC, Inc. (1 total)
ULVAC Launches NA-1500 Dry Etching System for 600mm Advanced Packaging Substrate …
Chigasaki, Japan - (JCN Newswire) - ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for uniform Descum and Ti etching processes.
Higher data transfer speeds require higher-density packaging technologies, while advanced mobile and wireless devices require thinner and higher-pin-count IC packages. Fan-Out Wafer Level Packaging (FO-WLP) is widespread, while Panel Level Packaging increases substrate size from 300mm to 600mm.
While there are…
