SiC Wafer Polishing Market is anticipated to reach USD 0.63 by 2030, growing at a CAGR of 38.0% during the forecast period of 2023-2030

The Global SiC Wafer Polishing Market was valued USD 0.4 Billion in 2023 and projected to reach USD 0.63 by 2030, growing at a CAGR of 38.0% during the forecast period of 2023-2030.

𝐃𝐨𝐰𝐧𝐥𝐨𝐚𝐝 𝐭𝐡𝐞 𝐒𝐚𝐦𝐩𝐥𝐞 -
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Major vendors in the global sic wafer polishing market - 3M, Ace Nanochem Co., Ltd., Advanced Abrasives Corporation, AGC Inc., Allied High Tech Products, DuPont Incorporated, Engis Corporation, Entegris, Ferro Corporation, Fujibo Holdings, Inc., Fujifilm Holdings America Corporation, Fujimi Incorporated, Iljin Diamond Co., Ltd., JSR Corporation, Kemet International Limited, Lapmaster Wolters, Logitech Ltd., Nitta DuPont Incorporated, Pureon, Saint-Gobain and Others.

SIC wafer polishing is a specialized manufacturing process designed to elevate the surface quality of Silicon Carbide wafers, ensuring their compliance with the rigorous standards of contemporary electronics and power devices. Silicon Carbide, recognized for its exceptional thermal conductivity, high breakdown voltage, and remarkable mechanical strength, has emerged as the preferred material for high-power and high-frequency applications. SiC wafers play a crucial role in RF applications like high-power amplifiers and communication systems. The refined wafers facilitate the development of high-frequency devices, minimizing signal losses and improving heat dissipation. Polished SiC wafers are indispensable in the production of optoelectronic devices, including UV photodetectors and high-power LEDs (Light-Emitting Diodes). The polished surface enhances light emission efficiency and sensitivity, crucial for optimal optoelectronic performance.

𝐃𝐞𝐯𝐞𝐥𝐨𝐩𝐦𝐞𝐧𝐭 𝐨𝐟 𝐚𝐝𝐯𝐚𝐧𝐜𝐞𝐝 𝐩𝐨𝐥𝐢𝐬𝐡𝐢𝐧𝐠 𝐜𝐨𝐧𝐬𝐮𝐦𝐚𝐛𝐥𝐞

The evolution of advanced polishing consumables has a substantial impact on the SiC wafer polishing market's expansion. Polishing consumables encompass various items employed in the wafer polishing procedure, such as abrasive slurries, pads, and chemicals. Progress in these consumables brings numerous advantages to the SiC wafer polishing market, propelling its growth and enhancing efficiency. A key benefit of contemporary polishing consumables lies in their ability to achieve heightened levels of precision and uniformity during the wafer polishing process. With SiC wafers becoming thinner and more intricately designed, the demand for precise and consistent polishing is on the rise.

Advanced consumables aim to provide greater control over material removal rates, surface roughness, and planarization, thereby elevating the overall quality of the wafers. This is particularly crucial for SiC wafers, given their distinctive properties that necessitate meticulous polishing for maintaining desired characteristics. Moreover, modern polishing consumables contribute to increased productivity and cost-effectiveness in the SiC wafer polishing process. They are engineered to enhance polishing efficiency, diminish polishing time, and minimize material wastage.

𝐌𝐚𝐫𝐤𝐞𝐭 𝐃𝐲𝐧𝐚𝐦𝐢𝐜𝐬

Drivers:
Increased usage of consumer electronics
Rising need for SiC-based power devices
Advancement in polishing consumables
Widespread adoption of SiC wafers in radio frequency (RF) devices

Opportunities:
Increasing investments in SiC research and development
Rise of novel applications

The market for SiC Wafer Polishing Market is dominated by North America.

In 2023, the SiC Wafer Polishing Market market in North America secured a prominent share. North America serves as a focal point for technological advancements and semiconductor manufacturing. The SiC wafer polishing market in the region is propelled by the presence of key industry players, significant research and development endeavors, and an increasing need for energy-efficient devices. In Europe, a robust semiconductor industry underscores the significance of SiC wafers in power electronics and automotive applications. The region witnesses a growing demand for SiC wafer polishing, driven by strict environmental regulations promoting the adoption of energy-efficient solutions. The Asia-Pacific region, spearheaded by countries like China, Japan, and South Korea, commands the global semiconductor market. SiC wafers find widespread applications in consumer electronics, automotive, and industrial sectors in this dynamic region.

The Diamond Slurries Segment is Anticipated to Hold the Largest Market Share During the Forecast Period

Based on product type, the Sic wafer polishing market is segmented into abrasive powders, polishing pads, diamond slurries, colloidal silica suspensions and others. Among these the segment diamond slurry Sic wafer polishing, is recognized as one of the most significant product categories. The inherent hardness and sharpness of diamond particles make them exceptionally effective in addressing the challenges posed by SiC wafers, resulting in precise material removal and outstanding surface smoothness. With the increasing demand for SiC-based power electronics, optoelectronics, and high-frequency devices, manufacturers are in search of advanced and reliable polishing solutions. Diamond slurry products meet these demands by providing excellent control over material removal rates and superior planarization, ultimately leading to improved device performance and yield.

𝐆𝐫𝐚𝐬𝐩 𝐚 𝐛𝐮𝐬𝐢𝐧𝐞𝐬𝐬 𝐨𝐩𝐩𝐨𝐫𝐭𝐮𝐧𝐢𝐭𝐲 𝐢𝐧 𝐒𝐢𝐂 𝐖𝐚𝐟𝐞𝐫 𝐏𝐨𝐥𝐢𝐬𝐡𝐢𝐧𝐠 𝐌𝐚𝐫𝐤𝐞𝐭. 𝐓𝐨 𝐛𝐮𝐲 𝐭𝐡𝐢𝐬 𝐫𝐞𝐩𝐨𝐫𝐭 @
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𝐑𝐞𝐜𝐞𝐧𝐭 𝐃𝐞𝐯𝐞𝐥𝐨𝐩𝐦𝐞𝐧𝐭𝐬
In October 2023, Wolfspeed announced a new 6-inch SiC wafer polishing facility in Durham, North Carolina. The facility is expected to be operational in 2024 and will double Wolfspeed's SiC wafer polishing capacity.
In September 2023, SiCrystal announced a partnership with Cabot Microelectronics to develop new polishing slurries for SiC wafers. The slurries are expected to improve the surface quality and defect density of SiC wafers.

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