High Density Interconnect Market Size, Share Analysis, Growth And Overview Report 2024-2033

The high density interconnect market size has grown rapidly in recent years. It will grow from $15.05 billion in 2023 to $16.71 billion in 2024 at a compound annual growth rate (CAGR) of 11.1%. The growth in the historic period can be attributed to miniaturization of electronics, consumer electronics boom, increase in mobile devices, performance enhancement, higher functionality requirements.

The high density interconnect market size is expected to see rapid growth in the next few years. It will grow to $24.82 billion in 2028 at a compound annual growth rate (CAGR) of 10.4%. The growth in the forecast period can be attributed to 5g technology implementation, rise in iot devices, emerging ai and machine learning applications, advancements in automotive electronics, growth in wearable devices. Major trends in the forecast period include technological advancements in pcb design, advancements in semiconductor technology, ultra-thin hdi solutions, increased layer count in hdi boards, rise in microvia technology.

Market Overview -

High-density interconnect (HDI) is a printed circuit board (PCB) that enables placing more components on the same board space. It is used to reduce the size of the PCB while adding more functionality and features to a single board.

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High-Density Interconnect Technology's Vital Role In The Automotive Industry Expansion

The increasing application of the automotive industry is expected to propel the growth of the high-density interconnect market going forward. The automotive industry is a sector that encompasses numerous organizations and firms involved in the design, development, manufacture, marketing, selling, and maintenance of motor vehicles. High-density interconnect (HDI) technology provides multiple benefits for the automobile industry in terms of improvement, higher performance, increased reliability, improved signal transfer, more minor elements, and price cuts. For instance, according to the Bureau of Transportation Statistics (BTS), a US-based agency that publishes information on transportation systems, new vehicle sales increased to 11,471 (Thousands of vehicles) in 2021. Therefore, the increasing application of the automotive industry drives the high-density interconnect market.

Competitive Landscape -

Major companies operating in the high density interconnect market report are Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologie & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., Empresa Provincial de Energía de Córdoba, CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co.Ltd, Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc, XPCB Limited, Sunstone Circuits LLC, 3CEMS Group.

Revolutionizing High-Density Interconnects By The Impact Of Double-Sided Imaging (DSI) Technology In The Market

Technological advancements are a key trend gaining popularity in the high-density interconnect market. Major companies operating in the high-density interconnect market are adopting new technologies such as double-sided imaging (DSI) technology to sustain their position in the market. Double-sided imaging (DSITM) technology allows the imaging of both sides of the PCB panel, doing away with the requirement for numerous independent DI, loader/unloader, and flipper systems. For instance, in October 2022, Orbotech Ltd. an Israel-based company that provides solutions for the electronics manufacturing industry launched 8M direct imaging (DI) system. The Orbotech Corus DI platform offers a fully automated and extensible solution for highly accurate and efficient patterning processes. This implies that a whole DI production line can be successfully replaced by a single, fully automated Orbotech Corus 8M DI system. The platform is expandable and economical, facilitating continual innovation for PCBs and IC substrates and offers higher resolution with great precision to pattern finer lines.

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Key Segments -

The high density interconnect market covered in this report is segmented -

1) By Type: Single Panel, Double Panel, Other Types
2) By Substrate: Rigid, Flexible, Rigid-Flex
3) By End User: Automotive, Consumer Electronics, Telecommunications, Medical, Other End-Users

Key highlights covered in the report -

1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics

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