Press release
Advanced Packaging Technologies Global Market Report 2024 - By Trends, Size, Share, Growth, Outlook By 2033
Advanced Packaging Technologies Market
The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $12.33 billion in 2028 at a compound annual growth rate (CAGR) of 14.0%. The growth in the forecast period can be attributed to heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, smart manufacturing. Major trends in the forecast period include advanced interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, embedded packaging for IoT devices.
Market Overview -
Advanced packaging technologies refer to the technologies involved in the aggregation and interconnection of components before traditional electronic packaging. It allows integrated circuits to be enclosed in a casing, which prevents metallic parts from corroding and physical damage.
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Surging Consumer Electronics Demand Fuels Growth In The Advanced Packaging Market
Growing demand for consumer electronics is expected to propel the growth of the advanced packaging market going forward. Consumer electronics refers to any electronic equipment, gadgets, or devices made to be purchased and used on a regular basis for non-commercial or professional purposes by consumers. Consumer electronics can create demand for advanced packaging as it plays an important role in defining the sophistication of the products. For instance, in June 2021, Oberlo, a Lithuania-based e-commerce platform, said that globally, 6.4 billion people use smartphones. Therefore, the growing demand for consumer electronics is driving the growth of the advanced packaging market.
Competitive Landscape -
Major companies operating in the advanced packaging technologies market report are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SÜSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Silicon Mobility SAS., Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Chip One Stop Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems
Technological Advancements Shaping The Advanced Packaging Technologies Market
The growing technological advancements are shaping the advanced packaging technologies market. Major companies operating in the advanced packaging technologies sector are focused on developing technological solutions for advanced packaging to expand their leadership in semiconductor solutions. For instance, in May 2021 Samsung Electronics, a South Korea-based electronics company launched Interposer-Cube4 (I-Cube4), an advanced chip packaging technology for high-performance applications. Interposer-Cube4 (I-Cube4), a 2.5D packaging technology improves communication and power effectiveness among logic and memory chips and is projected to be widely used in sectors such as high-performance computing, artificial intelligence (AI), 5G, cloud, and the largest data center applicants.
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Key Segments -
The advanced packaging technologies market covered in this report is segmented -
1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries
Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics
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