Enabling 5G Innovation: Non-UV Dicing Tapes Market Thrives at 6.0% CAGR, Reaching $2.8 Billion by 2033 Amid IoT and Miniaturization

The global non-UV dicing tapes market is anticipated to reach a valuation of US$ 1.59 billion in 2023, driven by growing demand for consumer electronics. The trend is expected to create new opportunities for the market, leading to a projected CAGR of 6.0% between 2023 and 2033, and reaching a total valuation of approximately US$ 2.8 billion by 2033.

One of the major factors contributing to the growth of the non-UV dicing tapes market is the expanding automotive electronics market. The automotive industry is undergoing a transformative shift toward electric and autonomous vehicles, amplifying the need for cutting-edge semiconductor technology.

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Non-UV dicing tapes are integral to this transformation, ensuring the accurate dicing of chips used in various automotive applications, including advanced driver assistance systems (ADAS), infotainment, and electric powertrains. The surge in demand for electric vehicles and smart automotive technologies directly translates into an increased requirement for non-UV dicing tapes.

Semiconductor manufacturers are seeking environmentally responsible solutions, as industries across the board embrace sustainability. Non-UV dicing tapes align with this trend, offering reduced particle generation and residue-free removal, minimizing waste and contamination during the dicing process. The adoption of non-UV dicing tapes gains momentum, as sustainability becomes an imperative.

The pace of technological innovation in the semiconductor industry is relentless, with new materials, designs, and processes constantly being developed. Non-UV dicing tapes evolve in tandem with these advancements, adapting to the changing landscape and ensuring compatibility with cutting-edge semiconductor manufacturing techniques.

Key Takeaways from the Market Study

*Global non-UV dicing tapes market was valued at US$ 1.5 billion by 2022-end.
*From 2018 to 2022, the market demand expanded at a CAGR of 3.0%.
*Asia Pacific is expected to expand at a dominant CAGR of 5.9 % during the forecast period.
*By material type, polyethylene terephthalate (PET) segment is expected to constitute a CAGR of 5.9% in 2033.
*On the basis of application, wafer dicing segment is expected to dominate the market with a CAGR of 5.9% in 2033.
*From 2023 to 2033, non-UV dicing tapes market is expected to flourish at a CAGR of 6.0%.
*By 2033, the market value of non-UV dicing tapes is expected to reach US$ 2.8 billion.

Semiconductor market growth, across the globe, is a major factor that is expected to propel the growth of the non-UV dicing tapes market in the near future, remarks an FMI analyst.

Non-UV Dicing Tapes Market: Dynamics

The demand for non-UV dicing tapes primarily influenced by the increased demand for the semiconductor manufacturing industry. Non-UV dicing tapes are increasingly gaining preference among semiconductor manufacturers due to the easy removal of chips from wafers after the dicing process.

The decrease in size chips or ICS in electronic devices is reduced due to technological advancements. Hence, it is driving the non-UV dicing tapes market among IC manufacturers. The demand for non-UV dicing tapes is expected to be escalated by the increasing electronic durable gadgets during the forecast period.

PET is the most commonly used material for the manufacturing of non-UV dicing tapes, owing to its advantages such as light in weight, stability, good barrier protection, and high-pressure resistance offered by PET material. Non-UV dicing tapes commonly used in wafer dicing applications.

The manufacturers are reducing the thickness of the wafer due to technological advancement and the growing demand for aesthetically thin electronic products. Thus it results in increased demand for non-UV dicing tapes during the forecast period. The increase in demand for electrical and electronic devices is expected to create an opportunity for the manufacturers of non-UV dicing tapes in the coming years.

It is due to an increase in demand for products such as computers and electrical appliances. Thus it has boosted the demand for PCBs and semiconductors. Therefore the market is expected to witness a positive outlook towards non-UV dicing tapes over the forecast period.

Non-UV Dicing Tapes Market: Regional Outlook

The Asia Pacific region represents remunerative growth opportunities for non-UV dicing tapes market during the forecast period. It is due to the rise in the consumption of compact semiconductors that generate demand for dicing tapes. There is an increased demand for non-UV dicing tapes in developing countries such as India, Brazil, etc.

Established packaging manufacturers are increasingly planning to set-up their manufacturing base in these countries. In addition, emerging economies import electronic components such as semiconductors and PCBs for the production of electronic devices.

Recent Development in Global Non-UV Dicing Tapes Market

In March 2017, the company set up QES Technology Phillippines Inc. in Manila. It increases the capacity of the company, and increase the supply of non-UV dicing tapes market in Manila.

Non-UV Dicing Tapes Market: Key Players

Some of the leading players operating in the non-UV dicing tapes market are as follows :

Pantech Tape Co. Ltd.
Furukawa Electric Co. Ltd.
Mitsui Chemicals Inc.
AI Technology, Inc.
LINTEC Corporation
Pantech Tape Co. Ltd
QES GROUP BERHAD

The report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts, and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macroeconomic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

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Non-UV Dicing Tapes Market: Segmentation

By Material Type:

PVC
PET
PO
Others (EVA, etc.)

By Thickness:

85-125 Micron
126-150 Micron
Below 85 Micron
Above 150 Micron

By Coating Type:

Single Sided
Double Sided

By Application:

Wafer Dicing
Package Dicing
Others (Glass, Ceramics)

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Future Market Insights, Inc. (ESOMAR certified, Stevie Award - recipient market research organization and a member of Greater New York Chamber of Commerce) provides in-depth insights into governing factors elevating the demand in the market. It discloses opportunities that will favor the market growth in various segments on the basis of Source, Application, Sales Channel and End Use over the next 10 years.

This release was published on openPR.