Global Underfill Dispenser Market Analysis and Forecast Predictions

Market Research Report Search Engine (MRRSE) recently announced the addition of a new research study to its comprehensive collection of research reports. The research report, titled “Underfill Dispenser Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2025” offers a detailed analysis of the market, providing insights into the market dynamics that are expected to influence the overall market positively in the next few years. Furthermore, the product segmentation, drivers, barriers, key geographical segments, and the competitive scenario of the Global Underfill Dispenser market have been elaborated upon in the research report.

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Underfill material is a filler, which is used in semiconductor packaging to offer strength, increase the impact resistance, and improve the overall reliability and thermo-mechanical performance. It is used to fill space beneath a die and adhere to its carrier. The proliferation of smart technologies and the subsequently rising demand for handheld devices such as smartphones and tablets are the key factors fuelling the demand for underfill dispensers. The demand is forecast to remain comparatively higher across emerging nations, which boast a booming automotive and consumer electronics industries. 

Besides this, underfill dispensers are increasingly utilized in the manufacture of wearable and portable devices used in the defense sector. This industry provides ample opportunities for the underfill dispenser market on account of the rising application of wearable devices integrated with underfill dispensers. In addition, the increasing demand for miniaturization of these devices will create lucrative market opportunities. 

On the flip side, the high initial investment required for research and development might limit the market’s growth in certain regions. Additionally, several smaller companies are reeling under the pressure of high research and development investment, which could have adverse impact on the overall market. Nevertheless, with the entry of new players, new products are likely to be innovated in the underfill dispenser market. This will in turn create boost the market. The global underfill dispenser market is forecast to exhibit a CAGR of 8.9% between 2017 and 2025. At this pace, the market’s valuation will reach US$91.19 bn by the end of 2025 from US$42.73 bn in 2016. 

Flip Chips Constituted Leading Application Segment by Revenue 

The market for underfill dispenser is segmented on the basis of product type and the segments are capillary flow underfill, no flow underfill and molded underfill. Capillary flow underfill accounted for the majority of the market share and is projected to do so over the forecast period. On the basis of end-use, the market of underfill dispenser has been divided into flip chips, ball grid array and chip scale packaging. In this segment, flip chip accounted for the largest market share and is likely to dominate the market. It contributed to over 52.6% of the overall revenue generated by the market in 2016. 

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Asia Pacific to Continue Dominating Overall Market 

With respect to region, the market for underfill dispenser is segmented into five regions such as North America, Europe, Asia Pacific, Middle East and Africa (MEA) and South America. Of these, Asia Pacific held the dominant share of 64.4% of the overall market in 2016. Besides the fact that the emerging nations in the region are home to booming consumer electronics and automotive sectors, they also boast a strong defense sector. Countries such as India, China, and Japan allocated increasing funds in the modernization of defense equipment. This provides lucrative growth opportunities for the underfill dispenser market in Asia Pacific. 

Global Underfill dispenser Market: By Geography

North America
S.
Rest of North America
Europe
K.
Germany
France
Rest of Europe
Asia Pacific
China
India
Japan
Rest of Asia Pacific
Middle East and Africa (MEA)
UAE
Rest of MEA
South America
Brazil
Rest of South America 
Global Underfill Dispenser Market: By Product Type

Capillary Flow Underfill
No Flow Underfill
Molded Underfill
Global Underfill DispenserMarket: By End-Use Type

Flip-Chips
Ball Grid Array
Chip Scale Packaging

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