Radiation-Hardened Electronics Market Report 2024: Size, Share, Growth Trends & Forecast 2033 | Key Players Overview

The radiation-hardened electronics market size has grown steadily in recent years. It will grow from $1.68 billion in 2023 to $1.76 billion in 2024 at a compound annual growth rate (CAGR) of 4.3%. The growth in the historic period can be attributed to military and defense applications, nuclear industry requirements, high-altitude aerospace mission, medical and healthcare equipment, security and critical infrastructure.

The radiation-hardened electronics market size is expected to see steady growth in the next few years. It will grow to $2.09 billion in 2028 at a compound annual growth rate (CAGR) of 4.4%. The growth in the forecast period can be attributed to rise of autonomous vehicles, miniaturization and compact electronics demand, iot and connected devices in extreme environments, security and critical infrastructure growth, expansion in medical devices. Major trends in the forecast period include space exploration and satellite technology, technological advancements, high-altitude aerospace applications, medical and healthcare equipment.

Market Overview -
Radiation-hardened electronics or rad-hard electronics are single-board computer central processing units (CPUs), and sensors that have been designed and produced to be less prone to damage from exposure to radiation and exceptionally elevated temperatures. It is a process of making a component or a system resistant to the damages that can be caused by cosmic rays, ionizing and other electromagnetic radiations.

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Rising Number Of Satellites To Drive Market Growth
The increasing number of satellites is expected to propel the growth of the radiation-hardened electronics market going forward. A satellite is a tool that is launched into space to orbit the Earth and collect data. Rad-hard electronics can withstand extreme radiation and temperatures better than commercial-grade chips, which makes them suitable for space environments and are preferred to be used in satellites by space agencies, private spaceflight companies, and others. For instance, according to United Nations Office for Outer Space Affairs (UNOOSA) records, 8,261 satellites are orbiting the Earth now, of which only 4,852 satellites are active. Therefore, the increasing number of satellites is driving the growth of the radiation-hardened electronics market.

Competitive Landscape -
Major companies operating in the radiation-hardened electronics market report are Microchip Technology Inc., BAE Systems Inc., Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics, Xilinx Inc., Texas Instruments Incorporated, Honeywell International Inc., Analog Devices Inc., Micropac Industries Inc., GSI Technology Inc., Mercury Systems Inc., Teledyne Technologies, Vorago Technologies, Maxwell Technologies, TTM Technologies Inc., International Business Machines Corporation, Data Device Corporation, Atmel Corporation, Intersil Corporation, Linear Technology Corporation, National Semiconductor Corporation, On Semiconductor Corporation, Silicon Laboratories Inc., Microsemi Corporation, X-Celeprint Limited, ABLIC Inc., Aeroflex Inc., Analogic Corporation, Crane Aerospace & Electronics

Technological Advancements Driving Innovation In Radiation-Hardened Electronics Market
Technological advancement is a key trend gaining popularity in the radiation-hardened electronics market. Major companies operating in the radiation-hardened electronics market are focused on advanced technologies to strengthen their position in the market. For instance, in July 2021, Renesas Electronics Corporation, a Japan-based semiconductor manufacturer, launched a brand-new series of radiation-hardened (rad-hard), plastic-packaged components for satellite power management systems. The ISL71001SLHM/SEHM point of load (POL) buck regulator, the ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver are the four new devices. These devices are all made with Giant Magneto Resistive (GMR) isolation technology, which offers better radiation tolerance than the currently available space-grade optocouplers. It combines high levels of assurance with the board area savings and cost benefits of plastic packing.

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Key Segments -
The radiation-hardened electronics market covered in this report is segmented -
1) By Product Type: Commercial-Off-The-Shelf (COTS), Custom Made
2) By Component: Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, Other Components
3) By Manufacturing Technique: Rad-Hard By Process, Rad-Hard By Design, Rad-Hard By Software
4) By Application: Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, Other Applications

Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics

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